- Heterogeneous Multicore Processor (HMP)
- 4K video decoding
- 4x Cortex-A53 @ 1.5 GHz & Cortex-M4 @ 266 MHz
This application processor module is optimized for advanced multimedia applications, incl. 4K video decoding, and comes with up to 4 cores.
The iMX8M COM Board features high-end graphic capabilities with both 3D and 2D engines and hardware accelerator for 4K video decoding.
Together with HDMI and MIPI DSI display outputs, MIPI CSI camera inputs, flexible audio interfaces and comprehensive communication features, the i.MX 8M is ideal for advanced multimedia applications.
Heterogeneous Multicore Processing (HMP)
The i.MX 8M processor comes with up to 4x Cortex-A53 cores and one Cortex-M4 core. This combination of different cores allows a feature rich OS, like Linux, to run on the Cortex-A cores while a Real-Time OS such as FreeRTOS can run on the Cortex-M4 core.
Get more information about HMP.
Power Optimized Design
Combining the processor with LPDDR4 memory and an efficient PMIC results in a very low power module.
The HMP architecture can reduce the power even more by letting the Cortex-A53 cores sleep until needed. The Cortex-M4 can wake them up on demand.
Compact form factor, 82×50 mm, using the proven MXM3 connector.
The module is based on NXP’s energy efficient i.MX 8M processor which has up to 4x Cortex-A53 cores capable at running up to 1.5 GHz and one Cortex-M4 core capable at running up to 266 MHz.
The iMX8M COM Board is available in industrial and commercial temperature ranges, -40 to +85 / 0 to 70 degrees Celsius, respectively. The industrial (temperature range) version is suitable for always-on applications.
Fully supported on NXP’s 10 and 15-year longevity program.
|CPU||4x Cortex-A53 @ 1.5 GHz, Cortex-M4 @ 266 MHz|
|RAM||1 GByte LPDDR4 3200 MT/s 32-bit databus|
|Flash||8 GByte eMMC|
|Graphics Output||HDMI, MIPI-DSI|
|Hardware 2D/3D Graphic||GC7000Lite, OpenCL 1.2 and Vulkan, OpenGL ES 1.1/2.0/3.0/3.1|
|Hardware Video||Decode: 4Kp60|
|Graphics input||2x MIPI CSI|
|Audio||5x SAI, SPDIF|
|USB||2x USB 3.0/2.0 OTG|
|Serial||3x SPI, 4x I2C, 4x UART|
|ADC / PWM||No / 4 ch|
|PCIe||2x PCIe Gen 2|
|Temperature||0 to 70°C or -40 to 85°C|
|Size||82 x 50 mm|
|Connector||314 pos MXM3|
|Product Classification and Status|
|Integration board; Sampling|