iMX7 Dual uCOM

Small footprint for portable devices
  • Heterogeneous Multicore Processor (HMP)
  • Small footprint 27x37 mm
  • 2x Cortex-A7 @ 1 GHz and Cortex-M4 @ 200 MHz
Image of iMX7 Dual uCOM

With its exceptionally small 27 x 37 mm footprint, this application processor module is a perfect fit for portable connected multimedia devices.

Heterogeneous Multicore Processing (HMP)

The iMX 7Dual comes with two Cortex-A7 cores and one Cortex-M4 core. This combination of different cores allows a feature rich OS, like Linux, to run on the Cortex-A cores while a Real-Time OS such as FreeRTOS can run on the Cortex-M4 core.
Get more  information about HMP.

Power Optimized Design for Portability

Combining the processor with LPDDR3 memory and Rohm’s efficient BD71815GW PMIC results in a very low- power module. The PMIC has built-in battery charger functionality.
The HMP architecture can reduce the power even more by letting the Cortex-A7 cores sleep until needed. The Cortex-M4 can wake them up on demand.

NXP Technology

The module is based on NXP’s energy efficient i.MX 7Dual processor  which has two Cortex-A7 cores capable at running up to 1 GHz and one Cortex-M4 core capable at running up to 200 MHz.

Temperature Range

The iMX7 uCOM board is available in extended and commercial temperature ranges, -20 to +85 / 0 to 70 degrees Celsius, respectively. The industrial (temperature range) version is suitable for always-on applications.

CPU Details
CPU2x Cortex-A7 @ 1 GHz, Cortex-M4 @ 200 MHz
RAM1 GByte LPDDR3 1066 MT/s 32-bit databus
Flash8 GByte eMMC
Graphics OutputMIPI-DSI, Parallel RGB
Hardware 2D/3D GraphicPixel Processing Pipeline
Hardware VideoSW only
Graphics inputMIPI CSI, Parallel CSI
Audio3x SAI
EthernetDual 10/100/1000 Mbps
Serial2x CAN, 4x I2C, 4x SPI, 7x UART
ADC / PWM4 ch (12-bit) / 4 ch
Serial ATA-
Temperature0 to 70°C or -20 to 85°C
Size27 x 37 mm
ConnectorDF40C: 1x70 2x100
Product Classification and Status
Integration board; Volume