- Hetrogeneous Multicore Processing (HMP)
for real-time processing
- 3D & 2D graphic engines
- Cortex-A9 @ 1 GHz and Cortex-M4 @ 227 MHz
This application processor module is optimized for industry applications that require both real-time processing and high quality graphics.
Heterogeneous Multicore Processing (HMP)
In addition to the main core, this module includes a Cortex-M4 core for real-time processing. The Cortex-M4 core can for example run FreeRTOS while the main core runs Linux and handles connectivity and the user interface (UI)The iMX6 SoloX application module is a great choice when upgrading from a traditional microcontroller design.
Get more information about HMP.
Compact form factor, 82×50 mm, using the proven MXM3 connector.
The module is based on NXP’s i.MX 6SoloX processor which has one Cortex-A9 core capable at running up to 1 GHz and one Cortex-M4 core capable at running up to 200 MHz.
The iMX6 SoloX COM board is available in industrial and commercial temperature ranges, -40 to +85 / 0 to 70 degrees Celsius, respectively. The industrial (temperature range) version is suitable for always-on applications.
|CPU||Cortex-A9 @ 1 GHz, Cortex-M4 @ 200 MHz|
|RAM||1 GByte DDR3L 800 MT/s 32-bit databus|
|Flash||4 GByte eMMC|
|Graphics Output||LVDS, Parallel RGB|
|Hardware 2D/3D Graphic||GC400T, OpenGL ES 1.1/2.0, OpenVG 1.1|
|Hardware Video||SW only|
|Graphics input||Analog, Parallel CSI|
|Audio||3x I2S, ESAI, SPDIF|
|Ethernet||Dual 10/100/1000 Mbps|
|USB||1x HS USB 2.0 Host, 1x HS USB 2.0 OTG|
|Serial||2x CAN, 4x I2C, 5x SPI, 6x UART|
|ADC / PWM||8 ch (12-bit) / 8 ch|
|Temperature||0 to 70°C or -40 to 85°C|
|Size||82 x 50 mm|
|Connector||314 pos MXM3|
|Product Classification and Status|
|Integration board; Volume|
|Product notes / changes|
|PCN: Changed size on QSPI|
|Note about Ethernet and RGB interface|
|Product compliance declarations|
|Longevity and PCN|