LPC3250 OEM

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  • ARM926EJ-S @ 266 MHz
  • Not recommended for new designs
Image of LPC3250 OEM

The LPC3250 OEM board is suitable for applications that require high performance, high integration, and low power consumption.

Compact form factor, 68×48 mm, using the proven SODIMM connector.

NXP Technology
The LPC3250  has a ARM926EJ-S core and was designed for low power, high performance applications.

 

Temperature Range
The LPC3250 OEM board is available in commercial temperature range, 0 to +70 degrees Celsius.

CPU Details
CPUARM926EJ-S @ 266 MHz
RAM256 KByte internal, 64 MByte SDRAM
Flash128 MByte NAND flash, 4 MByte NOR Flash
Multimedia
Graphics OutputParallel RGB
Hardware 2D/3D GraphicNo
Hardware VideoSW only
Graphics inputNo
AudioI2S
Connectivity
Ethernet10/100 Mbps
USB1x FS USB 2.0 OTG
Wi-FiNo
FlexIONo
Serial2x I2C, 2x SPI, 7x UART
ADC / PWM3 ch (10-bit) / 2 ch
SDMCI
PCIe-
Serial ATA-
Physical
Temperature0 to 70°C
Size68 x 48 mm
Connector200 pos SODIMM
Product Classification and Status
Integration board; Mature