• ARM926EJ-S @ 266 MHz
  • Not recommended for new designs
Image of LPC3250 OEM

The LPC3250 OEM board is suitable for applications that require high performance, high integration, and low power consumption.

Compact form factor, 68×48 mm, using the proven SODIMM connector.

NXP Technology
The LPC3250  has a ARM926EJ-S core and was designed for low power, high performance applications.


Temperature Range
The LPC3250 OEM board is available in commercial temperature range, 0 to +70 degrees Celsius.