RZ/G3L SOM

Unleash the RZ/G3L for Edge Computing
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  • 4x Cortex-A55 @1.2 GHz & Cortex-M33 @200 MHz
  • Display output via LVDS, MIPI-DSI or parallel RGB
  • H.264 Enc./Dec. 1080p30, Mali-G31 GPU@600 MHz
  • PCIe Gen2, Dual USB2, Dual Gigabit Ethernet
Image of RZ/G3L SOM

Experience a new level of intelligent performance with our new System-on-Module, integrating the versatile graphical capabilities with high-speed communication interfaces. This powerful combination delivers exceptional processing capabilities for HMI and Edge computing applications!

Advanced Multimedia

The RZ/G3L SOM features high-end graphic capabilities with both 3D and 2D engines and hardware accelerator for H.264 1080p30 video decoding and encoding.

With MIPI-DSI, LVDS or parallel RGB display output, MIPI-CSI camera inputs, flexible audio interfaces and comprehensive communication features, the RZ/G3L is ideal for industrial, user interface (HMI) and multimedia applications.

High-Speed Communication

The RZ/G3L SOM features supports PCIe2.0 (1 lane), dual USB2.0 (H/F/OTG), dual Gigabit Ethernet, triple CAN-FD, I3C, multiple SPI/UART/I2C/audio interfaces.

Renesas Technology

The module is based on Renesas’ energy efficient RZ/G3L application processor which has up to 4x Cortex-A55 cores capable at running up to 1.2 GHz and one Cortex-M33 core running up to 200 MHz – 13K DMIPS in total!

Temperature Range

The SOM is available in industrial and extended commercial temperature ranges, -40 to +85 / -25 to 70 degrees Celsius, respectively.

Compact form factor

82×30 mm, using the proven MXM3 connector.

Processor Details
CoresRenesas RZ/G3L Quad-core ARM Cortex-A55 and Cortex-M33
Frequency1.2GHz on Cortex-A55, 200 MHz on Cortex-M33
Further RZ/G3L informationRZ/G3L application processor (MPU) product page at Renesas
RZ/G3L datasheet from Renesas
RZ/G3L User's Manual can be found at Renesas
Memory
SDRAM1 GByte LPDDR4 2133 MT/s, 16-bit/1ch databus
NAND FLASH8 GByte eMMC NAND Flash for OS
QSPI NOR FLASH16 MByte QSPI NOR Flash for bootloader
Graphics output - single display supported
MIPI-DSI4 lanes with resolution up to 1920x1080/1200 at 60 Hz (1080p60/1200p60), pixel clock: 5.4 to 187.5 MHz
LVDSWXGA up to 1366x768/1280x800 60Hz, single link, pixel clock: 25 to 87 MHz
Parallel RGB18/24 bit up to WXGA, 1280x800 at 60 Hz (720/800p60), pixel clock: 5.4 to 87 MHz
Video Engine (VCD)H.264/265 Encode & Decode, up to 1080p30
3D GPUMali-G31 @600MHz delivering 6GFLOPS.
Supports Vulkan 1.2, OpenGL ES 1.1/2.0/3.2 and OpenCL 2.0 full
Graphics input
Camera interface1x MIPI-CSI2, 2 lanes, max 1.5Gbps per lane
High-Speed Communication
Ethernet2x Gigabit Ethernet interface based on Microchip KSZ9131RNXI Ethernet PHY
Wi-Fi/BTOptional Murata LBEE5HY2FY (2FY), 802.11a/b/g/n/ac/ax SISO, Wi-Fi 6E and 5.4 BR/EDR/BLE, SDIO interface, based on Infineon chipset CYW55513
PCIePCIe Gen2, 1 data lanes
USB3USB3.2 Gen2, Host-only
USB2USB2.0 (1 ch.: Host/Device, 1 ch.: Host-only)
Power
Supply voltage4-5V
Power Consumption4-5 Watts peak (TBD)
Mechanical
Dimensions (W x H x D)82 x 50 x 5 mm, EACOM form factor
ExpansionMXM3 format, 314 positions
Product Classification and Status
Integration board; In Development/Sampling