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- RZ/G3E: 4x Cortex-A55 @1.8 GHz & Cortex-M33 @200 MHz delivering 21.6K DMIPS
- Dual display capable via LVDS, MIPI-DSI or parallel
- H.264/265 Enc./Dec., Mali-G52 GPU@30GFLOPS
- Dual lane PCIe Gen3, USB3.2, Dual Gigabit Ethernet
- On-chip Ethos-U55 NPU, delivering 0.5 TOPS
Experience a new level of intelligent performance with our new System-on-Module, integrating the versatile graphical capabilities with a 0.5 TOPS on-chip NPU and high-speed communication interfaces. This powerful combination delivers exceptional processing capabilities for HMI and Edge computing applications!
Advanced Multimedia
The RZ/G3E OSM-L features high-end
With MIPI-DSI, LVDS and parallel RGB display outputs, MIPI-CSI camera inputs, flexible audio interfaces and comprehensive communication features, the RZ/G3E is ideal for industrial, user interface (HMI) and multimedia applications.
Ethos-U55 NPU
These capabilities are perfectly complemented by the on-chip Ethos-U55 NPU delivering 0.5 TOPS AI acceleration – suitable for entry level vision AI applications, voice AI and sensor data base AI applications.
The Ethos-U55 is controlled by the Cortex-M33 offloading the Cortex-A55 from the AI operations.
Renesas Technology
The module is based on Renesas’ energy efficient RZ/G3E application processor which has up to 4x Cortex-A55 cores capable at running up to 1.8 GHz and one Cortex-M33 core running up to 200 MHz – 21.6K DMIPS in total!
Temperature Range
The OSM-L is available in industrial temperature range, -40 to +85 Celsius. Commercial and extended temperature ranges (0 to 70 / -25 to 70 degrees) are available on request.
Compact OSM-L form factor
OSM-L, 45×45 mm.
| Processor Details | |
|---|---|
| Cores | Renesas RZ/G3E Quad-core ARM Cortex-A55 and Cortex-M33 |
| Frequency | 1.8GHz on Cortex-A55, 200 MHz on Cortex-M33 |
| Further RZ/G3E information | RZ/G3E application processor (MPU) product page at RenesasRZ/G3E datasheet from RenesasRZ/G3E User's Manual from Renesas |
| Memory | |
|---|---|
| SDRAM | 1 GByte LPDDR4 3200 MT/s, 32-bit/2ch databus. Other sizes on request. |
| NAND FLASH | 8 GByte eMMC NAND Flash for OS and bootloader. Other sizes on request. |
| On-chip NPU | |
|---|---|
| NPU | ARM Ethos-U55 256MAC, 512 GOPS (0.5 TOPS) |
| Graphics output | |
|---|---|
| MIPI-DSI | 4 lanes with resolution up to 1920x1080/1200 at 60 Hz (1080p60/1200p60) |
| LVDS | Single link: WXGA up to 1366x768/1280x800 60Hz, Dual link: up to 1920x1200 60Hz |
| Parallel RGB | 18/24 bit up to WXGA, 1280x800 at 60 Hz (720/800p60) |
| Video Engine (VCD) | H.264/265 Encode & Decode: 4Kp30 and 1080p60 |
| 3D GPU | Mali-G52 @630MHz delivering 30GFLOPS.Supports Vulkan 1.2, OpenGL ES 1.1/2.0/3.2 and OpenCL 2.0 full |
| Graphics input | |
|---|---|
| Camera interface | 1x MIPI-CSI2, 4 lanes, max 2.1Gbps per lane |
| High-Speed Communication | |
|---|---|
| Ethernet | 2x Gigabit Ethernet interface. External Phy needed (according to OSM standard). |
| Wi-Fi/BT | Optional Murata LBEE5HY2FY (2FY), 802.11a/b/g/n/ac/ax SISO, Wi-Fi 6E and 5.4 BR/EDR/BLE, SDIO interface, based on Infineon chipset CYW55513 |
| PCIe | PCIe Gen3, 2 data lanes |
| USB3 | USB3.2 Gen2, Host-only |
| USB2 | USB2.0 (1 ch.: Host/Device, 1 ch.: Host-only) |
| Power | |
|---|---|
| Supply voltage | 4-5V |
| Power Consumption | 4-5 Watts peak (TBD) |
| Mechanical | |
|---|---|
| Dimensions (W x D x H) | 45 x 45 x 5 mm, OSM-L form factor |
| Expansion | Solder pads on bottom side according to OSM-L standard |
| Product Classification and Status | |
|---|---|
| Integration board; In Development/Sampling | |
