Experience a new level of intelligent performance with our new System-on-Module, seamlessly integrating the versatile power of the Renesas RZ/G3E application processor with the groundbreaking DEEPX DX-M1 AI Booster. This powerful combination delivers exceptional processing capabilities and unprecedented AI performance!
Advanced Multimedia
The RZ/G3E DX-M1 SOM features high-end dual display graphic capabilities with both 3D and 2D engines and hardware accelerator for H.264 1080p60 and H.265 4Kp30 video decoding and encoding.
With MIPI-DSI, LVDS and parallel RGB display outputs, MIPI-CSI camera inputs, flexible audio interfaces and comprehensive communication features, the RZ/G3E is ideal for industrial, user interface (HMI) and multimedia applications.
These capabilities are perfectly complemented by the revolutionary 25 TOPS AI acceleration of the DX-M1 – suitable for vision applications.
The DX-M1 AI Booster communicates with the RZ/G3E Application Processor over a dual data channel PCIe Gen3 interface.
Renesas Technology
The module is based on Renesas’ energy efficient RZ/G3E application processor which has up to 4x Cortex-A55 cores capable at running up to 1.8 GHz and one Cortex-M33 core running up to 200 MHz – 21.6K DMIPS in total!
Compact form factor, 82×50 mm, using the proven MXM3 connector.
DEEPX Technology
The DEEPX DX-M1 redefines the landscape of edge AI, achieving unparalleled cost-efficiency (inference/$), power-efficiency (TOPS/W), and performance efficiency (FPS/TOPS). Delivering 25 TOPS at just 5 Watts, it’s ideal for diverse applications from smart factory robotics and vision to edge computing and smart mobility.
Temperature Range
The SOM is available in industrial and commercial temperature ranges, -40 to +85 / 0 to 70 degrees Celsius, respectively.
Scalable Solution – Edge Compute/AI
There is a version of the board; RZ/G3E SOM, without the DX-M1 mounted – allowing you to scale cost-effectively between Edge Compute to Edge AI applications!
