LOADING
- 802.11 a/b/g/n/ac-friendly™ and BT/BLE 5.0
- SDIO 3.0 interface, SDR40@80MHz
- Chipset: Infineon/Cypress CYW43012
The 1LV M.2 module, co-developed by Embedded Artists and Murata, is designed for evaluation, integration and ease-of-use.
You get started immediately by following our getting started guides:
Our M.2 Primer Package contains general information about the M.2 standard, reference schematics and an integration guide how to integrate an M.2 module in your next embedded design.
Murata has a specific landing page presenting our support for NXP’s i.MX application processor family.
For full specification on 1LV module (LBEE59B1LV) see Murata’s 1LV product page and 1LV datasheet.
| Module | |
|---|---|
| Murata module | LBEE59B1LV, also known as Murata 1LV |
| Chipset | Cypress CYW43012 |
| WLAN | |
|---|---|
| Standards | 802.11a/b/g/n/ac-friendly™ |
| Network | AP and STA dual mode |
| Frequency | 2.4 GHz & 5 GHz bands |
| Data rates | 11, 54, 65, 78 Mbps |
| Host interface | SDIO 3.0, SDR40@80MHz |
| Bluetooth | |
|---|---|
| Standards | 5.0 BR/EDR/LE 2MPHY |
| Power Class | Class 1 |
| Host interface | 4-wire UART@3MBaud |
| Audio interface | PCM for audio |
| Powering | |
|---|---|
| Supply voltage | 3.3V (3.2-3.6V) |
| Receive mode current (WLAN) | 20 mA typical |
| Transmit mode current (WLAN) | 230 mA typical |
| Mechnical | |
|---|---|
| M.2 standard | Type 2230-S3-EWidth 22 mm, length 30mm, component height 1.5 mm and E-key connector |
| Measurements | 22x30 mm without trace antenna |
| Weight | 1.5 gram |
| Temperature | |
|---|---|
| -20 to +70 degrees Celsius | |
| Flyers and specifications | |
|---|---|
| LBEE59B1LV Datasheet from Murata | |
| 1LV M.2 Datasheet | |
| Generic M.2 module 3D-models | |