1LV M.2 Module

Dual Band Wi-Fi 4, 802.11 a/b/g/n/ac + Bluetooth 5.0 Module
LOADING
  • Wi-Fi 4, 802.11 a/b/g/n/ac-friendly™
  • Bluetooth 5.0 BR/EDR/LE
  • SDIO 3.0 interface, SDR40@80MHz
  • Chipset: Infineon/Cypress CYW43012
Image of 1LV M.2 Module

We have partnered with Murata to design the 1LV M.2 module, suitable for evaluation, integration and ease-of-use.

You get started immediately by following our getting started guides:

Our integration guide help you integrate an M.2 module in your next embedded design. It for example contains general information about the M.2 standard and reference schematics.

Murata has a specific landing page presenting our support for NXP’s i.MX application processor family.

Not recommended for new design (NRND)

This product is not EOL, but no longer recommended for new designs. We produce it with MOQ 2000 pcs.

Recommended alternative

For full specification on 1LV module (LBEE59B1LV) see Murata’s 1LV product page and 1LV datasheet.

Module
Murata moduleLBEE59B1LV, also known as Murata 1LV
ChipsetInfineon/Cypress CYW43012
WLAN
Standards802.11a/b/g/n/ac-friendly™, Wi-Fi 4
NetworkAP and STA dual mode
Frequency2.4 GHz & 5 GHz bands
Data rates11, 54, 65, 72.2 Mbps
Host interfaceSDIO 3.0, SDR40@80MHz
Bluetooth
Standards5.0 BR/EDR/LE, 3MPHY, 2M LE PHY
Power ClassClass 1
Host interface4-wire UART@3MBaud
Audio interfacePCM for audio
Powering
Supply voltage3.3V (3.2-3.6V)
Receive mode current (WLAN)20 mA typical
Transmit mode current (WLAN)230 mA typical
Mechnical
M.2 standardType 2230-S3-E
Width 22 mm, length 30mm, component height 1.5 mm and E-key connector
Measurements22x30 mm without trace antenna
Weight1.5 gram
Temperature
-20 to +70 degrees Celsius
Product Classification and Status
Integration board; Volume