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- Wi-Fi 4, 802.11 a/b/g/n/ac-friendly™
- Bluetooth 5.0 BR/EDR/LE
- SDIO 3.0 interface, SDR40@80MHz
- Chipset: Infineon/Cypress CYW43012

We have partnered with Murata to design the 1LV M.2 module, suitable for evaluation, integration and ease-of-use.
You get started immediately by following our getting started guides:
Our integration guide help you integrate an M.2 module in your next embedded design. It for example contains general information about the M.2 standard and reference schematics.
Murata has a specific landing page presenting our support for NXP’s i.MX application processor family.
For full specification on 1LV module (LBEE59B1LV) see Murata’s 1LV product page and 1LV datasheet.
Module | |
---|---|
Murata module | LBEE59B1LV, also known as Murata 1LV |
Chipset | Infineon/Cypress CYW43012 |
WLAN | |
---|---|
Standards | 802.11a/b/g/n/ac-friendly™, Wi-Fi 4 |
Network | AP and STA dual mode |
Frequency | 2.4 GHz & 5 GHz bands |
Data rates | 11, 54, 65, 72.2 Mbps |
Host interface | SDIO 3.0, SDR40@80MHz |
Bluetooth | |
---|---|
Standards | 5.0 BR/EDR/LE, 3MPHY, 2M LE PHY |
Power Class | Class 1 |
Host interface | 4-wire UART@3MBaud |
Audio interface | PCM for audio |
Powering | |
---|---|
Supply voltage | 3.3V (3.2-3.6V) |
Receive mode current (WLAN) | 20 mA typical |
Transmit mode current (WLAN) | 230 mA typical |
Mechnical | |
---|---|
M.2 standard | Type 2230-S3-EWidth 22 mm, length 30mm, component height 1.5 mm and E-key connector |
Measurements | 22x30 mm without trace antenna |
Weight | 1.5 gram |
Temperature | |
---|---|
-20 to +70 degrees Celsius |
Product Classification and Status | |
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Integration board; Volume |
Flyers and specifications | |
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1LV M.2 Datasheet | |
LBEE59B1LV Product page at Murata | |
Generic M.2 module 3D-models |
Documentation and guides | |
---|---|
Getting started with M.2 modules - iMX 6/7/8/9 | |
Getting started with M.2 modules - iMX RT | |
Integration guide |