RZ/G3E SOM

Unleash the RZ/G3E for Edge Computing

Request a Quote

from: 55$

LOADING
  • RZ/G3E: 4x Cortex-A55 @1.8 GHz & Cortex-M33 @200 MHz delivering 21.6K DMIPS
  • Dual display capable via LVDS, MIPI-DSI or parallel
  • H.264/265 Enc./Dec., Mali-G52 GPU@30GFLOPS
  • Dual lane PCIe Gen3, USB3.2, Dual Gigabit Ethernet
  • On-chip Ethos-U55 NPU, delivering 0.5 TOPS
Image of RZ/G3E SOM

Experience a new level of intelligent performance with our new System-on-Module, integrating the versatile graphical capabilities with a 0.5 TOPS on-chip NPU and high-speed communication interfaces. This powerful combination delivers exceptional processing capabilities for HMI and Edge computing applications!

Advanced Multimedia

The RZ/G3E SOM features high-end dual display graphic capabilities with both 3D and 2D engines and hardware accelerator for H.264 1080p60 and H.265 4Kp30 video decoding and encoding.

With MIPI-DSI, LVDS and parallel RGB display outputs, MIPI-CSI camera inputs, flexible audio interfaces and comprehensive communication features, the RZ/G3E is ideal for industrial, user interface (HMI) and multimedia applications.

Ethos-U55 NPU

These capabilities are perfectly complemented by the on-chip Ethos-U55 NPU delivering 0.5 TOPS AI acceleration – suitable for entry level vision AI applications, voice AI and sensor data base AI applications.
The Ethos-U55 is controlled by the Cortex-M33 offloading the Cortex-A55 from the AI operations.

Renesas Technology

The module is based on Renesas’ energy efficient RZ/G3E application processor which has up to 4x Cortex-A55 cores capable at running up to 1.8 GHz and one Cortex-M33 core running up to 200 MHz – 21.6K DMIPS in total!

Temperature Range

The SOM is available in industrial and commercial temperature ranges, -40 to +85 / 0 to 70 degrees Celsius, respectively.

Compact form factor

82×50 mm, using the proven MXM3 connector.

Scalable Solution – Edge Compute/AI

There is a version of the board; RZ/G3E DX-M1 SOM, with the DX-M1 25 TOPS AI Booster mounted – allowing you to scale seamlessly from Edge Compute to Edge AI applications!

Note: The product picture is not correct. The DX-M1 AI Booster is not mounted on this board.

Processor Details
CoresRenesas RZ/G3E Quad-core ARM Cortex-A55 and Cortex-M33
Frequency1.8GHz on Cortex-A55, 200 MHz on Cortex-M33
Further RZ/G3E informationRZ/G3E application processor (MPU) product page at Renesas
RZ/G3E datasheet from Renesas
RZ/G3E User's Manual from Renesas
Memory
SDRAM2 GByte LPDDR4X 3200 MT/s, 32-bit/2ch databus
NAND FLASH16 GByte eMMC NAND Flash for OS and bootloader
On-chip NPU
NPUARM Ethos-U55 256MAC, 512 GOPS (0.5 TOPS)
Graphics output
MIPI-DSI4 lanes with resolution up to 1920x1080/1200 at 60 Hz (1080p60/1200p60)
LVDSSingle link: WXGA up to 1366x768/1280x800 60Hz, Dual link: up to 1920x1200 60Hz
Parallel RGB18/24 bit up to WXGA, 1280x800 at 60 Hz (720/800p60)
Video Engine (VCD)H.264/265 Encode & Decode: 4Kp30 and 1080p60
3D GPUMali-G52 @630MHz delivering 30GFLOPS.
Supports Vulkan 1.2, OpenGL ES 1.1/2.0/3.2 and OpenCL 2.0 full
Graphics input
Camera interface1x MIPI-CSI2, 4 lanes, max 2.1Gbps per lane
High-Speed Communication
Ethernet2x Gigabit Ethernet interface based on Microchip KSZ9131RNXI Ethernet PHY
Wi-Fi/BTOptional Murata LBEE5HY2FY (2FY), 802.11a/b/g/n/ac/ax SISO, Wi-Fi 6E and 5.4 BR/EDR/BLE, SDIO interface, based on Infineon chipset CYW55513
PCIePCIe Gen3, 2 data lanes
USB3USB3.2 Gen2, Host-only
USB2USB2.0 (1 ch.: Host/Device, 1 ch.: Host-only)
Power
Supply voltage4-5V
Power Consumption4-5 Watts peak (TBD)
Mechanical
Dimensions (W x H x D)82 x 50 x 5 mm, EACOM form factor
ExpansionMXM3 format, 314 positions
Product Classification and Status
Integration board; In Development/Sampling